Shanxun offers a full range of testing services,including:
AOI
Automatic Optical Inspection is the cost effective solution to replace traditional human inspection, at the same time reducing the need for expensive electrical test.
Inspection parameters include checks for component presence, type, polarity, offset, text and solder joint quality for both volume and profile (meniscus) plus the option to inspect the printed solder paste image.
Shanxu develops applications and deploys solutions based on OMRON AOI platforms. The OMRON represents a true inspection innovation by incorporating unique zoom, off-axis and patented color-illumination techniques. AOI reflects Kingsheng commitments to provide state-of-the-art and cost-effective test and inspection solutions for today high-technology products.
Function Testing
Shanxun will provide the capacity and service to carry out functional tests for your printed circuit boards. All functional printed circuit board testing is carried out with full engineering diagnostic support to ensure the tested boards are totally compliant with all submitted customer specifications.
Functional testing verifies that each function of the software application operates in conformance with the requirement specification.Each and every functionality of the system is tested by providing appropriate input, verifying the output and comparing the actual results with the expected results.
In Circuit Testing
In-circuit test (ICT) is an electrical probe tests a populated printed circuit board (PCB), checking for shorts, opens, resistance, capacitance, and other basic quantities which will show whether the assembly was correctly fabricated. It may be performed with a bed of nails type test fixture and specialist test equipment, or with a fixtureless in-circuit test setup.
Testing Jig
The test jig has two functions:
1) to check that the preamp can hold voltages applied to the power rails, and that the supply currents drawn are within tolerance
2) to provide a fast electronic pulse that is applied to the input of the preamp and compare the output waveform to an expected shape. The tester is also designed to be operated conveniently and quickly.
At Shanxu, we do ofen customised test jig design and manufacturing. All the PCBA products must been 100% full tested.
X-Ray for BGA Testing
Automated X-ray inspection (AXI) is a technology based on the same principles as automated optical inspection (AOI). It uses X-rays as its source, instead of visible light, to automatically inspect features, which are typically hidden from view.
As BGA connections are not visible the only alternative is to use a low level X-ray inspection. AXI is able to find faults such as opens, shorts, insufficient solder, excessive solder, missing electrical parts, and mis-aligned components. Defects are detected and repaired within short debug time.
AXI in Shanxun commitments to offering you the complete test and inspection solution
Printing Solder Paste Test
To ensure the quality of the printing, it needs to monitor the printing press parameters: printing speed / squeegee pressure / printing gap / separation distance / clean frequency / paste thickness / the viscosity. All these parameters should be met the specification. The thinkness and viscosity of the paste should be also met the specification.
The specifications of the thickness of the stencil and tin coating:
0.12mm 0.11 ~ 0.17mm 0.18mm 0.15 ~ 0.23mm
0.15mm 0.13 ~ 0.21mm 0.20mm 0.17 ~ 0.25mm
Paste neither is a solid, not a liquid, it is a mixed paste objects, the main component is the solder powder (tin powder) and the flux (flux)
To achieve a good printing durability, it is required to solder paste viscosity at the low level when printing. So that the stecil is easier to fall the paste and demould.After demoulding, in order to ensure that the solder paste does not collapse, it needs a higher viscosity, so it should add the solder paste thixotropic agent. The thixotropic agent can make the the viscosity of the solder paste at a sharp decline during exercise. When stopping motion, the viscosity will soon recover. So that it can achieve good printability.
(1) Printing Red Glue
The red glue is usually kept in the refrigerator at the optimum temperature. It should be remove thawed at room temperature before using. And then open and stir to use.The dosage shoulbe be not to exceed two hours. It also needs to check if the red glue printed on the bottom of the PCB mounting components with full and moderate. So that there is no infiltration of red glue mount to the the pad and connectors (or pins). At the same time, the red glue can make the components bonding and fastening. So that when wave soldering, the components are not easy to fall.
(2) Printing Solder Paste
The solder paste is usually kept in the at the refrigerator proper temperature. Be fore using, it should be removed from the refrigerator and thawed to room temperature. And then open and stir until uniform, smooth and put into use. It also needs to check after printing the solder paste is uniform amount printed on the PCB pads, with or without collapse and scattered at the surface of the PCB to ensure good reflow soldering components. And there is no beads scattered on the plate surface.