| PCB Assembly Capability | ||
| 1 | Min. IC Pitch | 0.30mm(12mil) |
| 2 | Foot Pin | SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA |
| 3 | Min. Chip Placement | 01005 |
| 4 | Max. PCB Size | 410mm x 600mm(16.2" x 23.6") |
| 5 | Type of assembly | THD,SMT,SMT&THD Mixed |
| 6 | Maximum BGA Size | 74mm x 74mm(2.9" x 2.9") |
| 7 | BGA Ball Pitch | 1mm ~ 3mm(4mil ~ 12mil) |
| 8 | BGA Ball Diameter | 0.4mm ~ 1mm(16mil ~ 40mil) |
| 9 | QFP Lead Pitch | 0.38mm ~ 2.54mm(15mil ~ 100mil) |
| 10 | Testing Service | IC programming, custom testing, free DFM checking, ICT, FCT. |
| 11 | Package | Anti-static Bubble Bag & Carton |
|
Product Type |
Qty |
Normal lead time |
Quick-turn lead time |
|
SMT |
5~200 |
2WD |
8H |
|
SMT |
201~2000 |
3-5WD |
2WD |
|
SMT |
≥2000 |
6WD |
3WD |
|
SMT+DIP |
5~200 |
3WD |
2WD |
|
SMT+DIP |
201~2000 |
5WD |
4WD |
|
SMT+DIP |
≥2000 |
7WD |
5WD |