| PCB Capability | ||
| 1 | Layers | 1-24 layers |
| 2 | Base Material | FR4, High Tg FR4, Halogen Free, SYL, Rogers, Aluminium,Polymide. |
| 3 | Finished Board Thickness | 0.2mm ~ 7.0mm(8mil-276mil) |
| 4 | Copper Thickness | 1/3oz ~ 7oz |
| 5 | Surface Finishing |
HASL, Lead Free HASL, Immersion tin, Immersion gold, Gold plating, Immersion silver, OSP, Carbon, etc. |
| 6 | Min. Trace Width/Space | 0.075mm(3mil) |
| 7 | Min. Finish Holes Size | 0.1mm(4mil) for laser holes; 0.2mm(8mil) for mechanical holes |
| 8 | Max.Finshed Size | 530mm x 620mm (20.9" x 24.4") |
| 9 | Hole Tolerance | PTH:±0.076mm(+/-3mil), NTPH:±0.05mm(+/-2mil) |
| 10 | Soldermask Color | Green, White, Black, Red, Yellow, Blue |
| 11 | Silkscreen Color | White, Black, Yellow, Blue |
| 12 | Impedance Control | +/-10% |
| 13 | Profiling Punching | Routing, V-CUT, Chamfer |
| 14 | Special techniques |
Blind/Buried holes, Gold fingers,peelable soldermask,Carbon mask,half hole,press fit hole, via in pad,via plugged,Countersink holes |
| 15 | Reference Standard | IPC-A-600H Class 2, Class 3 |
| 16 | Certificate | UL, ISO9001, ROHS, SGS |